Thermal Paste TCG 100

My-T-Therm 100 TCG

My-T-Therm®100 TCG is a non-curing thermal interface material designed to transfer thermal energy from a heat source to a heat sink.

  • Good thermal conductivity
  • Electric Resistance over wide temperature range
  • Medium Viscosity

Pack Size:

My-T-Therm®100 TCG is ideally available in

  • 500 gm and 1 Kg Pack

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Description

Product Features & Benefits

 Non-curing
 Stable at high temperature.
 Low oil bleed.
 Good thermal conductivity.
 Application includes gap filling in processor chips, CPU, transistor thermal modules and other heat generated electronic components to PCB’s assemblies, and LED Lights.

Specification

Sr No Properties Value
1.) Appearance White Paste
2.) Specific gravity 2.19
3.) Service Temperature Range -50 to150° C
4.) Thermal Conductivity, ISO 22007 1 W/mk
5.) Viscosity Brookfield DV II+ Pro

Spindle#6 Speed 20 rpm, ASTM D1084

 45000 to 50000 cP

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